Announcement: 3D Finite Element Modeling and Analysis of Micromechanical Sensors

This work is dedicated to finite element (FE) 3D structural and modal analysis of various micromechanical sensors. All researched objects are made of silicon by means of formation technology methods. During the research 3D close-to-reality mathematical models have been created.

The analysis performed allows us with a high degree of accuracy to determine stresses, strains and deflections appearing both in manufacture and operation of researched devices. The modal analysis allows obtaining operational frequencies. As the result of the research performed the new parameters of micromechanical sensors have been determined which can be used to improve their characteristics.